Packet in Plastic Grid Array - meaning and definition. What is Packet in Plastic Grid Array
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What (who) is Packet in Plastic Grid Array - definition

TYPE OF SURFACE-MOUNT PACKAGING FOR INTEGRATED CIRCUITS
Land Grid Array; Ceramic land grid array; Plastic land grid array; Flip-chip plastic land grid array
  • CPU]].
  • Installing a CPU with LGA socket.

Packet in Plastic Grid Array      
<integrated circuit> (PPGA) The package used for Intel's Celeron Socket 370 CPU. [Description?] (1999-06-24)
Pin Grid Array         
  • Underside of an 80486 with lid removed shows die and wire bonded connections
  • AMD 754]])
  • Closeup of the pins of a pin grid array
  • AM2+ socket]]
  • View of the socket 7 321-pin connectors of a CPU
  • Underside of a [[Pentium 4]] in a PGA package
  • The underside of a FC-PGA package (the die is on the other side)
  • An example of a socket for a staggered pin grid array package
  • The topside of a [[Celeron]]-400 in a PPGA packing
TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
<hardware> (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. PGA is often used on motherboards for processors, e.g. Socket 6 and Socket 8. PPGA is "plastic PGA" (as opposed to ceramic?). See also SPGA. (2000-03-09)
Staggered Pin Grid Array         
  • Underside of an 80486 with lid removed shows die and wire bonded connections
  • AMD 754]])
  • Closeup of the pins of a pin grid array
  • AM2+ socket]]
  • View of the socket 7 321-pin connectors of a CPU
  • Underside of a [[Pentium 4]] in a PGA package
  • The underside of a FC-PGA package (the die is on the other side)
  • An example of a socket for a staggered pin grid array package
  • The topside of a [[Celeron]]-400 in a PPGA packing
TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
<hardware> (SPGA) A style of integrated circuit socket or pin-out with a staggered grid of pins around the edge of the socket, positioned as several squares, one inside the other. SPGA is commonly used on motherboards for processors, e.g. Socket 5, Socket 7 and Socket 8. See also PGA. [Better description?] (1999-08-04)

Wikipedia

Land grid array

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.